Film adhesives
Film adhesive for electrical, thermal, and mechanical assembly applications
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you need reliable RF ground plane performance, try LOCTITE® ABLESTIK CF 3350. This silver-filled flexible film adhesive has high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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Uniform bondline adhesion
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High thermal & electrical conductivity
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Silver filled
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Minimum thermal resistance to heat sink
Cure schedule, @ 150.0 °C:
30.0 min.
Cure type:
Heat cure
Physical form:
Film
Thermal conductivity:
7.0 W/mK