Features and Benefits

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
  • Flexible
  • Reworkable
  • Resilient bonds between materials with mismatched CTEs
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Technical Information

Carrier Type Polyimide Film
Cure Schedule Temperature (Step 1) 257
Cure Schedule Temperature Unit (Step 1) °F
Cure Schedule Time (Step 1) 2
Cure Schedule Time Unit (Step 1) hr.
Cure Type Heat Cure
Physical Form Film
Shear Strength Unit, Aluminum psi
Shear Strength, Aluminum 1800
Technology Epoxy