TECHNOMELT PA 657

Features and Benefits

Available in:

20KG Sack (cross bottom)

1.0/case
TECHNOMELT PA 657, Polyamide, Molding compound thermoplastic
TECHNOMELT® PA 657 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance.
  • Easy moldability
  • Good adhesion to a variety of substrates
  • Cold temperature flexibility
  • Excellent moisture resistance
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Documents and Downloads

Safety Data Sheets and RoHs
  • 20KG Sack (cross bottom) 1.0/case - IDH 251715
TECHNOMELT PA 657, 20kg 251715 en-US
IDH: 251715

Size Case: 20KG Sack (cross bottom)

Quantity: 1.0/case

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Additional Documents

Brochure: Low Pressure Molding Solutions Encapsulate and Protect Your Electronics in Three Simple Steps
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English

Technical Information

Color Black
Elongation, at break 400.0 %
Key Characteristics Viscosity: Low Viscosity
Operating Temperature -40.0 - 100.0 °C
Physical Form Liquid
Shore Hardness, ISO 868/15s Durometer A 77.0
Softening Point Temperature 157.0 °C
Substrates Flexible Substrate
Technology Polyamide (PA)
Viscosity, @ 210.0 °C 3700.0 mPa·s (cP)