Die attach adhesives
Medium to large die attach electrically non-conductive adhesive
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.
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High MRT performance
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High thermal conductivity
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Electrically insulating
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High reliability
Applications:
Die attach
Coefficient of thermal expansion (CTE):
28.0 ppm/°C
Cure type:
Heat cure
Viscosity, Brookfield CP51, @ 25.0 °C:
13000.0 mPa·s (cP)