LOCTITE® ABLESTIK CDF 600
Features and Benefits
LOCTITE® ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
- Low warpage
- Consistent bondline control with minimal die tilt
- Pre-cut wafer lamination equipment compatible
- Recommended for thin wafer handling applications