Die attach adhesives
Electrically conductive adhesive for microelectronic chip bonding applications
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Electrically conductive
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Low bleed
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Low outgassing
Applications:
Die attach
Cure schedule, @ 150.0 °C:
1.0 hr.
Cure type:
Heat cure
Number of components:
1 part
Physical form:
Paste
Shear strength, Aluminum:
1500.0 psi
Storage temperature:
-40.0 °C
Thixotropic index:
4.0
Viscosity, Brookfield CP51, @ 25.0 °C:
30000.0 mPa·s (cP)
Volume resistivity:
0.0005 Ohm cm