Die attach adhesives
Popular electrically-conductive adhesive for high-speed dispensing
This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 84-1LMISR4 is one of the most widely used die-attach products in the semiconductor industry. This electrically conductive adhesive is specially formulated for use in high throughput, automated die-attach equipment. You can rely on minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and a work life up to two weeks for small series assemblies.
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Electrically conductive
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box oven cure
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Excellent dispensability
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Minimal tailing or stringing
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Long work life
Application method:
Dispense system
Applications:
Die attach
Coefficient of thermal expansion (CTE):
40.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
150.0 ppm/°C
Color:
Silver
Cure schedule, @ 175.0 °C:
1.0 hr.
Cure type:
Heat cure
Extractable ionic content, Chloride (CI-):
20.0 ppm
Extractable ionic content, Potassium (K+):
10.0 ppm
Extractable ionic content, Sodium (Na+):
10.0 ppm
Glass transition temperature (Tg):
120.0 °C
Moisture absorption, 168 hr. @ 85°C/85% RH:
0.6 %
Number of components:
1 part
Physical form:
Paste
Recommended for use with:
LeadFrame: gold,LeadFrame: silver
Tensile modulus, @ 250.0 °C:
300.0 N/mm² (44000.0 psi)
Thermal conductivity:
2.5 W/mK
Thixotropic index:
5.6
Viscosity, Brookfield CP51, @ 25.0 °C:
8000.0 mPa·s (cP)
Volume resistivity:
≤ 0.0002 Ohm cm