Electrically non-conductive adhesives
Electrically non-conductive, die attach adhesive designed to minimize stress
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Electrically non-conductive
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1-part: no mixing required
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Fast cure
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Low cure temperature
Applications:
Die attach
Coefficient of thermal expansion (CTE):
54.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
128.0 ppm/°C
Cure schedule, Recommended, @ 110.0 °C:
90.0 sec.
Cure type:
Heat cure
Extractable ionic content, Chloride (CI-):
29.0 ppm
Extractable ionic content, Potassium (K+):
19.0 ppm
Extractable ionic content, Sodium (Na+):
89.0 ppm
Glass transition temperature (Tg):
120.0 °C
Hot die shear strength:
7.0 kg-f
Key characteristics:
Conductivity: electrically non-conductive
RT die shear strength:
25.0 kg-f
Tensile modulus, DMTA, @ 25.0 °C:
68.0 N/mm² (10000.0 psi)
Thermal conductivity:
0.35 W/mK
Thixotropic index:
4.2
Viscosity, Brookfield CP51, @ 25.0 °C:
11000.0 mPa·s (cP)