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Lead-free for High-reliability, High-temperature Applications

For applications that require extremely high-reliability, current SAC materials are less than ideal, particularly devices for end use in the automotive and military/aerospace markets. Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications, yet still be solderable at a reasonable temperature. It would need to be lead-free for high-reliability, high-temperature applications.

Authors: Hector Steen, Ph.D., Brian Toleno, Ph.D.