Henkel Adhesive Technologies

Henkel Adhesive Technologies

Optical

Optical transceivers, switches, and components move data at the speed of light across metro, long haul, sub-sea, and data center interconnect (DCI). Optical devices demand smaller footprints, faster processing power, improved long-term reliability, and cost-effectiveness. In production, alignment and assembly precision are critical.

close up view of internet network connector with fiber optics

At a glance

50-70%

of network costs

Optical transceivers comprise 50-70% of 5G network costs.1

$392B

of hardware costs

In data centers, optics is shifting from 10% to 50% of total hardware cost as 400G goes mainstream.2

$392B

CAGR

200% unit volume CAGR for 400G and 300% unit volume CAGR for 800G in the next four years.3

Explore our other Data and telecommunication solutions

  • Broadband connectivity

  • Data center

Optical solutions

Optical transport networks provide high-speed data communications access for growing volumes of data. Optical interconnects must be reliable and efficient and advanced materials help improve performance.

 3D graphic of optical cables representing the transfer of data.

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Resources

Applications

3D graphic of 400G optical transceiver exploded view
Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Optical Transceiver

Optical transceivers utilize laser diodes and photodiodes for high-speed data transmission over fiber optic cables. Advanced materials in optical transceivers help maintain stability, enable precise alignment, and deliver optimal light into the optical fiber, enabling high-speed data transmission.

3D graphic of a optical switch component (WSS) exploded to show interior components.
Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Wavelength Selective Switch

WSS helps improve telecom network availability and facilitate high-speed data transfer rates, making them a crucial part of telecom networks. These components must be precisely aligned and durably bonded for reliable long-term function.

3D graphic of a roadm component exploded to show interior components.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

ROADM

Reconfigurable optical add-drop multiplexer (ROADM) systems are critical for telecom performance, enable effortless, flexible management of wavelengths, and monitoring of network optimization. Advanced materials must enable precise alignment, durable bonding and reliable long-term functionality.

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