To save valuable space inside vehicle designs, engineers are constantly seeking to miniaturize components, including power electronics such as inverters and on-board chargers. At the same time, power electronics are not only becoming smaller, but also more powerful, as proven by next-generation ADAS systems. Both trends are making thermal management an even higher priority as larger amounts of heat are being released while less surface area is available to act as a heat sink.
Recognizing this market trend towards small-sized, high power density automotive electronics, Henkel developed a new liquid Gap Filler technology that is able to dissipate heat with an unchallenged 7 W/mK. In addition, with a dispense of rate of up to 18 g/sec, the material is also suitable for mass production.
During this web-seminar, our speakers from Henkel, ZFW (Zentrum für Wärmemanagement) and bdtronic (Dispensing Systems) provide:
- An introduction to the BERGQUIST TGF7000 (liquid Gap Filler with 7 W/mK), the design considerations and building blocks to reach up to 18 g/sec dispense rate (Henkel)
- An overview of the testing methods, failure mechanisms and design rules, as well as an application thereof to TGF7000 (ZFW)
- An understanding of how to enable fully automated taylored dispensing technology or large-scale production (bdtronic)
Join our speakers Stephan Hoefer (Henkel), Holger Schuh (Henkel), Florian Schütz (bdtronic) and Robert Liebchen (ZFW) to learn more about this innovation.