The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.

As the market leader in semiconductor packaging and electronics assembly materials, Henkel has in-depth expertise and a broad market portfolio to address the requirements of current and future camera module demands. Furthermore, with an unmatched global manufacturing footprint and local support, Henkel is unparalleled when it comes to camera module success.

Author: Raj Peddi