Increased requirements for rich media streaming, cloud-based storage, data mining and analytics and machine learning applications has accelerated the demand for next- generation high-speed network access and data processing. Materials used to produce and protect state-of-the-art electronics play a large role in determining performance and reliability and Henkel leads the market with advanced solutions for datacom applications.
Cloud-based storage and data mining analytics require increase more capable hard disk drive (HDD) and solid state drive (SSD) devices for storage and faster data access.
This has led to an increase in the number of HDD and SDD components on a single line card, making more effective heat transfer a necessity. GAP PAD® and liquid gap filler from Henkel are helping datacom specialists cope with these challenging demands.
Cool Technology for Hyperscale Performance
Resources for Datacom
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