Henkel adhesive materials are used in nearly all telecom devices. Our reliable formulations are trusted for the assembly of power amplifiers, transmitters, receivers, couplers, filters, servers and routers, as well as with RF modules such as SiPs, power transistors, oscillators, optical fiber and more.

Henkel’s unique product line meets emerging market demands for improved RF performance in next-generation wireless telecommunications equipment, as well as increased thermal dissipation requirements for achieving longer distance communication capabilities. Henkel’s solutions for these market challenges include RF grounding adhesives in film and paste formats.

A reliable electrical interconnection is the basis of proper high level electronics functionality. Henkel’s long and successful history of formulation innovation – from high-reliability alloys to game-changing, temperature-stable solder pastes – continues to deliver the performance that electronics specialists require for today's demanding assemblies. In addition to solder, we offer a broad range of electrically conductive adhesives that enable long-term, reliable electronic performance for active and passive component attachment.

Henkel's innovative printed inks offer strong component and PCB interconnect for on-demand, long-term, reliable performance.

Henkel protection solutions are designed to increase the lifetime of sensitive electronics against moisture, corrosion, adverse environmental conditions, electromagnetic interference, vibration and mechanical shock. Henkel’s portfolio of protecting materials is broad, covering everything from potting materials to low pressure molding products to conformal coatings and underfills for component reinforcement.

Thermal management of today's telecom and datacom equipment designs is more critical than ever. Low profiles, rack mounting density, and high ambient temperatures in equipment cabinets are few of the thermal management challenges designers face today. As the market leader in thermal management materials, Henkel’s high-performance BERGQUIST brand thermal interface materials (TIMs) span a wide range of mediums and thermal conductivities to accommodate various heat dissipation requirements and manufacturing preferences. Printable phase change TIMs, custom die-cut GAP PADs and liquid dispensable gap fillers offer the conformity, low stress and thermal conductivity required to move heat away from critical components. Thermally conductive adhesives in paste and film format are used in telecom and datacom applications around the world. Henkel thermal products are also used in many common telecom devices to effectively dissipate heat and facilitate longer distance communication capabilities.

Henkel bonding products for optical components transceivers, optical fiber and more.

For precise bonding of delicate lenses and fiber where alignment and bond strength are critical for performance, Henkel has developed a suite of adhesives with various cure profiles for lens bonding, active alignment and fiber bonding applications. Our portfolio includes materials with low coefficient of thermal expansion (CTE)/shrinkage properties, fast curing formulations, and materials adjusted to accommodate specific optical requirements.

As the market leader for electrically conductive adhesives for passive components and active bare die, Henkel offers a wide range of electrically conductive materials - in paste and film format - meeting all requirements for long-term reliable interconnection of parts used in optical devices. Together with our history of innovative solder paste formulations, including solder paste for high-reliability requirements, we also can provide a full range of connecting solutions for optical components.

The sensitive electronic assemblies in devices like optical transceivers or optical engines often require powerful protection against harsh environmental factors like moisture and corrosion, vibration and mechanical shock. Henkel’s line of protecting materials for optical components includes underfill, conformal coatings, bare die encapsulants and materials for module sealants.

With optical component power increasing, thermal management for reliable function is more important than ever before. Henkel´s thermal management solutions for optical components include a wide range of high thermally conductive materials in different formats, including liquid, pad and film mediums.