Durable structural assembly is central to the aesthetics, function and lifetime of consumer devices. However, bonding the various components of the enclosure, sub-assembly and external decorative elements is becoming increasingly challenging, particularly given the variety of substrates used for each part of the structure. Henkel’s wide range of chemistry platforms – from polyurethane reactive hot melt (PUR) to methyl methacrylate (MMA), polyurethane (PU), cyanoacrylate (CA), epoxy and silicone – enables bonding dissimilar substrates, delivers process-friendly production, eliminates the need for tapes and screws, and helps prevent penetration of external contaminants like dust and water.

Enclosure Bonding Applications in Smart Phone

Henkel's structural adhesives combine high bond strength with the water-blocking qualities of low shrinkage, dense cross-linking and pressure resistance, as well as offers ease of use.

PUR Hotmelt

Typical Applications

Focused range of high performance structural bonders of cases and components.

Features

Cures at room temperature with moisture reaction. Bond variety of materials such as plastics, metals and glass.

Benefits

  • One-part, solvent-free
  • Good adhesion to plastic, metal, glass and composite
  • Fast fixturing
  • Very thin bondlines
  • Long open time
  • Low cost
  • Wide variety of formulations available
  • Low shrinkage

2-Part Polyurethane

Typical Applications

Front cover/glass patch to frame bonding, etc.

Features

  • Bonds a wide variety of materials, including most metals, plastics and composites
  • Exhibits superior moisture and humidity resistance, as well as good toughness and flexibility

Benefits

  • Low warpages
  • High temperature / humidity performance
  • Fast fixture
  • Superior flexibility
  • Excellent impact & shear strength
  • Halogen-free
  • Low shrinkage

2-Part Acrylate

Typical Applications
Structural bonding of cover glass, frames and components.

Features

  • Specially formulated to provide tough, longlasting bonds to most surfaces, including steel, galvanized steel, aluminum, sheet metal, stainless steel, plastics and composites.
  • Capable of reducing or replacing the need for threaded fasteners, welds or rivets, resulting in a lower cost assembly.

Benefits

  • Superior shear strength
  • Excellent impact resistance
  • High temperature / humidity performance
  • Fast fixture

Epoxy

Typical Applications
1-Part and 2-Part materials for a variety of applications, including coating, bonding and sealing, etc.

Benefits

  • No small molecular generation during curing
  • Strong, stable polymer network structure
  • Low curing shrinkage
  • Very good physical property
  • Excellent reliability performance
  • Highest level structural bonding
  • Low outgassing


Equipment for Adhesive Applications

Henkel offers equipment designed specifically for material applications, providing a comprehensive solution for performance success. From simple handheld devices to fully automated systems, Henkel offers a complete line of standard off-the-shelf LOCTITE brand dispensing and light curing equipment, which can be integrated easily into your manufacturing process.

Resources for Structure Bonding Materials

 

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