Application Challenges and Objectives
A high power, high wattage data center line card with multiple processors required a robust, heat management solution to optimize performance.
Server line cards are expected to have high reliability with a relatively long lifetime, with in-service use projections in the range of 10 years or more.
As design goals change, CPUs/processors are maintaining current thicknesses but expanding in the X, Y dimension to accommodate increasing function. This dynamic makes the larger footprint devices more susceptible to thermal stress, so the thermal interface materials (TIMs) employed must address this condition.