Henkel high-purity encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of LOCTITE ECCOBOND glob tops. These materials for chip-on- board applications are designed to cure quickly to fit easily within high-speed manufacturing operations.
Like all Henkel materials, LOCTITE ECCOBOND liquid encapsulants are formulated and tested in-process and in the context of full package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature lead-free environments.