LOCTITE® ABLESTIK ABP 2450

Features and Benefits

LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have a low moisture uptake and high light stability performance to extend LED lamp product life.
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 61.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 118.0 ppm/°C
Cure type Heat Cure
Glass transition temperature (Tg) 67.0 °C
Thixotropic index 5.5
Viscosity, Brookfield DV-II, @ 25.0 °C Speed 5 rpm 14000.0 mPa·s (cP)