LOCTITE® ABLESTIK ABP 8037TI

Features and Benefits

LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 62.0 ppm/°C
Cure type Heat Cure
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Potassium (K+) 1.0 ppm
Extractable ionic content, Sodium (Na+) 20.0 ppm
Hot die shear strength 7.4 kg-f
RT die shear strength 17.6 kg-f
Young's modulus, @ 250.0 °C 1300.0 N/mm² (188549.0 psi )