LOCTITE® ABLESTIK QMI529HT-LV
功能與優點
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
瞭解更多
技術資訊
| RT 模剪切強度 | 20.0 kg-f |
| 可萃取出的離子含量, 氟化物(F-) | 9.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 9.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 9.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 拉伸模量, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| 熱模剪切強度 | 3.75 kg-f |
| 熱膨脹係數 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK QMI529HT-LV
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.