BERGQUIST® SIL PAD® TSP 3500
被称为 Sil-Pad® 2000
功能与优点
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- 热阻抗0.33°C-in2/W（@50psi）
- 高导热系数3.5 W/m-K
- 最佳导热性能
技术信息
| 导热性 | 3.5 W/mK |
| 操作温度 | -60.0 - 200.0 °C |
| 标准厚度 | 0.254 - 0.508 mm |
| 载体类型 | 玻璃纤维 |
| 阻燃性 | V-0 |
| 颜色 | 白 |
常见问题
BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500产品之间的主要区别是什么？
我应该在什么时候为我的应用选择BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500？
BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500之间的导电特性是否存在差异？
我如何知道哪种SIL PAD产品适合我的特定用途？
什么是IS09001:2008？
BERGQUIST® SIL PAD® TSP 3500
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.