BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market

BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.