LOCTITE® ABLESTIK ABP 8142B3

功能与优点

LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications.
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技术信息

固化方式 热+紫外线
应用 芯片焊接
粘度,博勒菲 CP51, @ 25.0 °C Speed 5 rpm 14500.0 mPa.s (cP)
触变指数 3.5