LOCTITE® ABLESTIK QMI529HT-LV
功能与优点
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
了解更多
技术信息
| RT 模剪切强度 | 20.0 kg-f |
| 可萃取出的离子含量, 氟化物 (F-) | 9.0 ppm |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| 热模剪切强度 | 3.75 kg-f |
| 热膨胀系数 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK QMI529HT-LV
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.