Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

COVID-19 Update

Henkel corporate provides some information regarding Henkel and COVID-19.

Read More

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Author: Mark Currie, Ph.D; Neil Poole, Ph.D; Wanda O’Hara and Doug Dixon