BERGQUIST® SIL PAD® TSP Q2000
Známe ako Q-Pad® 3
Vlastnosti a výhody
Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
Farba | Čierna |
Hodnotenie horľavosti | V-0 |
Prevádzková teplota | -60.0 - 180.0 °C |
Tepelná vodivosť | 0.2 W/mK |
Typ nosiča | Sklenené vlákno |