BERGQUIST® GAP PAD® TGP HC3000
Známe ako Gap Pad® HC 3.0
Vlastnosti a výhody
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Farba | Modrá |
| Hodnotenie horľavosti | V-0 |
| Prevádzková teplota | -60.0 - 200.0 °C |
| Tepelná vodivosť | 3.0 W/mK |
| Typ nosiča | Sklenené vlákno |
| Youngov modul, ASTM D575 | 110.0 KPa (16.0 psi ) |
| Štandardná hrúbka | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP HC3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.