BERGQUIST® GAP PAD® TGP 1000VOUS

Poznano kot Gap Pad® VO Ultra Soft

Lastnosti in prednosti

Prenos tehničnega lista
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
Preberite več

Dokumenti in prenosi

Tehnični list
BERGQUIST GAP PAD TGP 1000VOUS
Prenos tehničnega lista

Ali iščete tehnični list ali varnostni list v drugem jeziku?

Poiščite tehnični list v drugem jeziku
Poiščite varnostni list v drugem jeziku

Dodatni dokumenti

BERGQUIST GAP PAD TGP 1000VOUS Halogen Report
Prenos dokumenta

Slovenščina

Selection Guide: Thermal Interface Materials Selection
Prenos dokumenta

Slovenščina

Tehnične informacije

Barva Rožnata
Delovna temperatura -60.0 - 200.0 °C
Standardna debelina 0.508 - 6.35 mm
Toplotna prevodnost 1.0 W/mK
Vrsta nosilca Steklena vlakna
Youngovi moduli, ASTM D575 55.0 KPa (8.0 psi )