Thermal Interface Materials

GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. Gap Filler can be used to interface even the most fragile and delicate devices. GAP FILLER is primarily for use in applications where a strong structural bond is not required.

GAP PADs provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. In addition, GAP PADs ensure low stress on component leads, while providing vibration damping and are compatibility with automated dispensing equipment.

SIL PAD materials meet the critical needs of a rapidly changing electronics industry because SIL PAD thermally conductive insulators are a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. They offer excellent thermal performance, are more durable than mica, create less mess than grease and are highly cost-efficient.

When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are the preferred materials. Larger bonding areas are problematic for pastes and other liquid-based mediums, as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses.

Henkel’s broad portfolio of adhesives provides robust mechanical attachment, allowing for the elimination of fasteners and reduced device size and weight. To accommodate various manufacturing requirements, thermal or room-temperature cure mechanisms are offered. Like all Henkel thermal materials, the complete line of adhesive pastes is RoHS compliant.

Ideal for high-performance solid-state devices such as CPUs, GPUs, IGBTs and discrete components, LOCTITE® and BERGQUIST phase-change films deliver on-demand performance with none of the drawbacks of traditional greases. These materials are solid at room temperature, but melt and flow during device operation to provide a thin bondline and high reliability without the “pump-out” often experienced with some thermal greases.