LOCTITE® 3517M

Features and Benefits

One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Technical Information

Coefficient of thermal expansion (CTE) 65.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 191.0 ppm/°C
Cure schedule light intensity 30.0 mW/cm²
Cure schedule, Recommended @ 120.0 °C 5.0 min.
Glass transition temperature (Tg) 78.0 °C
Viscosity, Haake PK1.2 2600.0 mPa·s (cP)