LOCTITE® ABLESTIK 3880
Features and Benefits
LOCTITE 3880, Epoxy, Good Adhesion, Conductive Adhesive
LOCTITE® ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. Typical applications include bonding surface mount devices to flexible or rigid substrates, bonding of semiconductor elements, joining EMI parts, bonding electrodes, lead wires or other connectors that require conductivity.
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Technical Information
| Cure schedule, @ 125.0 °C | 10.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Paste |
| Shear strength, Aluminum | 600.0 psi |
| Storage temperature | 0.0 °C |
| Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 14, speed 5 rpm | 100000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 3880
LOCTITE 3880, Epoxy, Good Adhesion, Conductive Adhesive