BERGQUIST® SIL PAD® TSP 1800

BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.