BERGQUIST® GAP PAD TGP 1000VOUS

Poznat kao Gap Pad® VO Ultra Soft

Elementi i pogodnosti

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behaviour.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Tehnički podaci

Boja Ružičasta
Jangov modul, ASTM D575 55.0 KPa (8.0 psi )
Radna temperatura -60.0 - 200.0 °C
Standardna debljina 0.508 - 6.35 mm
Tip nosača Staklena vuna
Toplotna provodljivost 1.0 W/mK