BERGQUIST® GAP PAD® TGP HC3000
Poznat kao Gap Pad® HC 3.0
Elementi i pogodnosti
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
Pročitajte više
Dokumenti i preuzimanja
Tražite tehničke listove ili bezbednosne listove na drugom jeziku?
Tehnički podaci
| Boja | Plava |
| Jangov modul, ASTM D575 | 110.0 KPa (16.0 psi ) |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.508 - 3.175 mm |
| Tip nosača | Staklena vuna |
| Toplotna provodljivost | 3.0 W/mK |
BERGQUIST® GAP PAD® TGP HC3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.