LOCTITE® ABLESTIK 2112 BIPAX
Elementi i pogodnosti
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive
LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 2 dela |
| Preporučuje se za upotrebu sa | Metal |
| Raspored polimerizacije, Preporučeno @ 65.0 °C | 4.0 sat |
| Sila smicanja, Aluminijum | 1900.0 psi |
| Temperatura čuvanja | 27.0 °C |
| Tiksotropni indeks | 6.5 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, Brookfield, Spindle RV7, Speed 10 rpm | 60000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2112 BIPAX
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive