LOCTITE® 3611
Elementi i pogodnosti
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 deo |
| Casson viskoznost, kugla / pločae Haake PK100, M10/PK1, 2° | 20.0 - 50.0 Pa∙s |
| Fizički oblik | Gel |
| Raspored polimerizacije, @ 150.0 °C | 90.0 - 120.0 sekunda |
| Sila smicanja, Čelik (peskirani) | 2175.0 psi |
| Temperatura čuvanja | 2.0 - 8.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® 3611
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive