Flip-Chip Process Improvements for Low Warpage

Flip-chip (FC) die attachment has gained significant use in production over the years due to electrical performance and small form factor. However, mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly.

Authors: Robert L. Hubbard, Pierino Zappella, Pukun Zhu

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