BERGQUIST® HI FLOW THF 1000F-AC
Cunoscut ca Hi-Flow® 225F-AC
Funcții și beneficii
BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material
BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact BERGQUIST Product Management for applications that are less than 0.07'' square.
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Conductivitatea termică | 1.0 W/mK |
Culoare | Negru |
Evaluare flacără | V-0 |
Grosimea peliculei suport | 0.38 mm |
Grosimea standard | 0.102 mm |
Temperatura de funcționare | 120.0 °C |
Temperatura de schimbare a fazei | 55.0 °C |