BERGQUIST® GAP PAD TGP 1000VOUS

Known as Gap Pad® VO Ultra Soft

Features and Benefits

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behaviour.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Read More

Technical Information

Carrier type Fiberglass
Color Pink
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 6.35 mm
Thermal conductivity 1.0 W/mK
Young's modulus, ASTM D575 55.0 KPa (8.0 psi )