Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

COVID-19 Update

Henkel corporate provides some information regarding Henkel and COVID-19.

Read More
This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure.

As more power is driven through active devices, the integrity of materials used to make the electrically conductive interfaces are becoming ever more critical to the performance of RF radar systems. A variety of technologies including thermal grease, solder and adhesive materials have been used to achieve this interface. In many applications, the use of conductive film adhesives are employed to take advantage of key benefits of the materials such as consistent and uniform bondline control, high electrical conductivity, and lower processing temperatures. This paper will compare the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure.