TECHNOMELT® low pressure molding solutions offer streamlined processing and excellent protection for modern electronic components, printed circuit boards (PCBs) and lighting applications. The simplicity of these products is their advantage: the entire TECHNOMELT® operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged. Learn why TECHNOMELT® is increasingly being chosen as an alternative to potting and encapsulating processes.

TECHNOMELT® materials deliver exceptional electrical insulation, as well as temperature, vibration and solvent resistance for many applications. The broad product range protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure and extreme thermal cycling.

Low Pressure Molding Technology

Low pressure molding is a faster and more efficient process than conventional potting. TECHNOMELT® is a one-part material that requires no mixing or curing; reduces material consumption through streamlined, multi-level, contour-exact encapsulation; and offers a sustainable solution through its unique re-usable formulation and green chemistry. Integrating TECHNOMELT® as an alternative to potting also reduces part numbers by eliminating the need for a housing or additional parts to achieve strain relief.



The Benefits

Simplified Manufacturing Process 

Part of TECHNOMELT’s appeal is its ease of processing.  Whereas conventional potting can involve as many as eight or more distinct steps and take as long as 24 hrs. to complete, the low pressure molding process can be achieved in as little as 30 seconds. 

Hot melt polyamides are poured into the melt tank, which is attached to the low pressure molding equipment. After heating to between 180°C and 210°C, the liquidus material is injected into a pre-designed mold set which contains the electronic device. Low pressure and heat are applied, after which the electronics are fully encapsulated and can be handled and tested. 

Sustainability


 
  • Zero waste
  • All excess material and scrap are recyclable
  • Natural ingredients
  • No harmful fumes from molding process
  • Long shelf life
  • RoHS and REACH compliant

Material Compatibility


 
  • Lightweight material
  • Excellent adhesion to multiple surfaces
  • Watertight encapsulation
  • High temperature, shock, environmental and solvent resistance
  • No cure process required
  • No fillers, so mold sets can be made out of less expensive aluminum and still be durable
  • Safe, 1-component, UL 94-V0 approved
  • Compliant materials suitable for sensitive electronic components

Cost Savings

 
  • Fewer physical parts, reducing the number of items on the bill of materials (BOM)
  • Reduced shipping costs of final products
  • Reduced total cost of ownership (TCOO)
  • Increased throughput
  • Low capital equipment costs
  • Reduced inventory and wok in process (WIP)
  • Lower labor cost per part

Low Pressure Molding Technology for Cables & Connectors

The Process

How does low pressure molding with TECHNOMELT® work? It's really simple, because you are able to encapsulate your electronic products in only three steps:

  1. Insert bare electronics into your predesigned mold set
  2. TECHNOMELT® encapsulates electronics at low pressure and temperatures
  3. Test parts and move them to final assembly — immediately after molding

 Application Versatility 

As electronic device manufacturers continue to move toward more cost-effective and sustainable solutions, TECHNOMELT integration for viable protection of electronic components and systems is accelerating. Today, TECHNOMELT is used in a wide range of applications, such as the recent lighting enhancement on a bridge in a major US city, where TECHNOMELT was used to encase 25,000 LED circuit boards, protecting the sensitive LED electronics from the harsh geographic environment. TECHNOMELT also was chosen to protect electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill in the Gulf of Mexico.   TECHNOMELT can be found in these high-visibility applications, as well as in products like coffee makers, self-driving cars, GPS tracking devices and PC accessories.  

 

Resources for Low Pressure Molding

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