Solder Materials Science Gets Small

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules.Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Designing much smaller packages presents its own unique hurdles, but the ability to incorporate these microscopic components into a high-volume, high-reliability production environment for assembly specialists.

Author: Neil Poole, Ph.D., Brian Toleno, Ph.D.