LOCTITE® ABLESTIK XCE 3104XL

Features and Benefits

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly
LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing performance using standard SMT equipment. LOCTITE ABLESTIK XCE 3104XL cures completely using a typical solder eutectic reflow cycle or at lower temperatures when required. LOCTITE ABLESTIK XCE 3104XL won the SMT Vision Award in 2002 in the best adhesive/encapsulant/coating category.
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Technical Information

Cure schedule, @ 125.0 °C 15.0 min.
Cure type Heat Cure
Number of components 1 Part
Recommended for use with Metal: Tin / Lead
Storage temperature -40.0 °C
Viscosity, Brookfield CP52, Speed 5.0 rpm 54000.0 mPa·s (cP)
Volume resistivity 0.0005 Ohm cm