Smartphone and Tablet

Fingerprint Button Bonding
Henkel delivers a full portfolio of material solutions from conductive and non-conductive adhesives, die attach materials to encapsulants  for robust sensor development and production

Fingerprint Sensors

Camera Module Bonding
A range of materials that includes die attach and bonding adhesives allows reliable, streamlined assembly of fixed-focus and auto-focus lenses to ensures proper lens alignment for reliable performance and cures quickly for better processing.

Semiconductor Image Sensors

EMI Shielding
Package-level compartment and conformal coating EMI solutions facilitate smaller and thinner system-in-package designs.  The materials enable high automation and provide excellent shielding performance. 

EMI Shielding

MEMS Applications
Henkel’s comprehensive portfolio of off-the-shelf die attach, underfill, encapsulant and adhesive materials allows MEMS manufacturers to meet challenging performance requirements and time-to-market timelines.

MEMS

Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices. 

Solder Materials, ECA, Inks & Coatings

Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices. 

Solder Materials, ECA, Inks & Coatings

Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices. 

Solder Materials, ECA, Inks & Coatings

Wireless Charger Element Bonding
Henkel structural adhesives deliver high bond strength on various substrates with extremely fast fixturing for high volume production. 

Structure & Bonding

Back Cover Bonding
Advanced structural adhesives provide strong adhesion on plastic,metal and glass substrates with fast fixturing for high UPH.

Structure & Bonding

Flexible Printed Circuit (FPC) Bonding
Loctite reinforcement materials provide added protection for flex circuitry used in smartphone applications. Good adhesion,high flexibility and crack resistance properties safeguard FPCs against damage. 

Structure & Bonding

Cover Glass Bonding
Structural adhesives for smartphone cover glass bonding combine high adhesion strength and impact resistance.  The ability to rework these materials allows customers to reduce costs and maximize resources. 

Structure & Bonding

Speaker Mesh Bonding
PUR hotmelt, MS, UV and 2-Part polyurethane solutions for speaker mesh bonding deliver excellent bond strength and thin bondlines for minimized footprints.

Structure & Bonding

Side Key Button Bonding
Henkel structural adhesives are designed for low surface energy substrate bonding which is critical  to side key's responsiveness. Our materials also can be fast cured for efficient production.

Structure & Bonding

Thermal Interface Materials
Liquid and soft, compliant pad TIMs provide critical thermal management for smaller, higher-functioning smartphones. Heat is transferred away from the  components to prevent overheating and preserve performance.

Thermal Interface Materials

Coatings & Encapsulation
Henkel encapsulation and conformal coating materials protect PCBs and components against shock, drop, vibration, moisture and water ingress – making wearable devices more durable and reliable. 

Glob Top & Encapsulants, Conformal Coating

Glob Top & Encapsulants
Loctite encapsulants protect PCBs and components from shock, drop and vibration with strong adhesion, moisture resistance and IPX7 waterproofing without impacting signal strength, antenna capability or acoustic performance. 

Glob Top & Encapsulants

Underfill
Loctite brand underfills streamline processing with fast flow and quick curing. They surround delicate array device interconnects for strong, long-lasting protection to enhance reliability.

Underfill

Thermal Gel
Henkel's thermal gel materials offer ultra low modulus, excellent conformability to intricate geometries, efficient and simplified material usage and customizable flow characteristics.

Gap Filler

USB Connector Sealing
Advanced encapsulant and sealant technologies cover and protect USB connection ports, allowing device function while providing a barrier to prevent water’s penetration.

Device Protection

Frame Bonding & Sealants
Henkel structural adhesives combine high bond strength with the water-blocking qualities of low shrinkage, dense cross-linking and pressure resistance in easy-to-process formulations. 

Structure & Bonding

Component Gasketing
To allow more production flexibility and reworkability, Henkel offers materials that enable sealant curing prior to assembly. With precise viscosity, an optimized durometer and a low compression set, Henkel cured-in-place gasketing (CIPG) materials deliver robust water protection.

Gasket Sealants

Cavity Gasketing
Henkel's liquid gasketing materials can be dispensed onto areas between rigid surfaces upon curing, provides well protection  against moisture, corrosion, shock, drop and vibration. 

Gasket Sealants

Enclosure Impregnation
Henkel’s wide range of chemistry platforms – from PUR hotmelts to MMAs, polyurethanes, cyanoacrylates, epoxies and silicones – can be impregnate into enclosures and help prevent penetration of external contaminants like dust and water.

Structure & Bonding, HOTMELT

Earphone Sealants
Around vulnerable entry points, such as the earphone socket, high performance sealants and encapsulants safeguard against water entry – helping to preserve electronic integrity should water immersion or exposure occur.