Smartphone and Tablet
Adhesive solutions for mobile devices
Americas
Asia-Pacific
Europe
India, Middle East & Africa
Henkel offers innovative adhesives optimized to provide the processibility needed for intricate handheld applications. The materials snap cure at low temperatures to keep pace with fast production cycle times and are highly stable, offering convenient storage, staging and use conditions. Henkel offers a wide range of underfills that improve the mechanical robustness of CSP, BGA, LGA and WLSP components in mobile phones and other handheld devices, as well as underfills that dramatically improve the thermal cycle reliability of flip chip assemblies.
Advanced LOCTITE® structural bonding adhesives ensure the device's enclosure, sub assembly and external decorative elements are assembled for the long-term. A broad portfolio of chemistry platforms provides manufacturers with choice and flexibiltiy for application-specific requirements and provide a barrier to external contaminants and water ingress.
Through close customer partnership, industry know-how and engineering support, Henkel enables innovative design for smartphones and tablets.
Henkel’s leadership in the tablet and handheld sector is unmatched. In addition to the most comprehensive range of enabling materials that span the package-level to the board level to the external structure, our team provides the experience, engineering knowledge and documented design and application know-how for fast time-to-market and dependable device performance.
Brochure: Henkel Solutions for Touch Panels and Displays
Please fill out the form below and we'll respond shortly.