Henkel’s specialized materials, designed to be applied at the package level, have optimal properties and characteristics that provide reliable shielding and adhesion performance in stressful electronic conditions and environments.

Our compartmental shielding materials portfolio showcases adaptable designs for internal component-to-component shielding with in-package partition, while our conformal shielding materials provide for external package-to-package shielding with an outer coating layer.

Henkel’s flexible material formulations not only mean more reliability and greater functionality, but ensure innovations that deliver more scalable processes, higher production throughput (UPH) and a lower cost of implementation for EMI shielding solutions.

Typical Structure and Solutions for EMI Shielding

Webinar: EMI Shielding Solutions for Semiconductor Packages

Package Level EMI Shielding Solutions

Resources for Package Level EMI Shielding

 

Data Package: LOCTITE ABLESTIK EMI 8880S

Data Package: LOCTITE ABLESTIK EMI 8660S

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