Mar 7, 2018 Irvine, CA – At last week’s IPC APEX Expo event in San Diego, CA, Henkel’s Adhesive Electronics group continued its winning streak, landing two trophies in Circuits Assembly magazine’s annual NPI Awards contest. The program, which recognizes leading products for electronics assembly introduced during the last year, leverages a judging panel of practicing industry engineers to decide the most impactful technologies as compared to others in specific categories. Each product is evaluated on challenging metrics including creativity and innovation, compatibility with existing technology, cost-effectiveness, design, reliability, flexibility, performance, user-friendliness and throughput capability.
Having participated in the NPI Awards for over ten years, Henkel has been honored for product innovation in solder materials, thermal interface materials, circuit board protection formulations and masking/coating solutions. This year, the company won the Coatings/Encapsulants category with its novel package-level EMI shielding materials and the Underfills/TIMs category with its peelable thermal interface material (TIM), BERGQUIST GAP FILLER TGF 1500RW.