Epoxy Flux Technology

A new material system — called epoxy flux — is enabling many applications in both semiconductor packaging and printed circuit board (PCB) assembly, as well as some of the emerging device configurations such as package-on-package (POP). Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

Authors: Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu

Contact Us

Please fill out the form below and we'll respond shortly.

There are some errors, please correct them below
What would you like to request?
This field is required
This field is required
This field is required
This field is required
This field is required
This field is invalid