BERGQUIST® GAP PAD® TGP 1000VOUS
Zināms kā Gap Pad® VO Ultra Soft
Iezīmes un ieguvumi
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
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Tehniskā informācija
| Darbības temperatūra | -60.0 - 200.0 °C |
| Junga modulis, ASTM D575 | 55.0 KPa (8.0 psi ) |
| Krāsa | Sārta |
| Nesēja veids | Stikla šķiedra |
| Siltumvadītspēja | 1.0 W/mK |
| Standarta biezums | 0.508 - 6.35 mm |
BERGQUIST® GAP PAD® TGP 1000VOUS
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.