LOCTITE® ABLESTIK 561KAP

Iezīmes un ieguvumi

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
Apraksts

Tehniskā informācija

Bīdes izturība, Alumīnijs 1800.0 psi
Fizikālā forma Virskārta
Nesēja veids Poliimīds
Sacietināšanas veids Sacietināšana karsējot
Ārstēšanas grafiks, @ 125.0 °C 2.0 h