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Features and Benefits


BERGQUIST GAP PAD HC 3.0, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad

BERGQUIST® GAP PAD HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress.

BERGQUIST GAP PAD HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD HC 3.0 is supplied with protective liners on both sides.

  • Thermal conductivity: 3.0 W/m-K
  • Silicone-free formulation
  • Minimal compression set
  • 0.5 mil film provides tack-free surface
  • Tacky side allows for ease of handling and placement
  • High performance and high compliance
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